Semicore Horizon-T 150/200 兼容设备 CMP
产品型号:Semicore Skylens CMP
产品简介:1. Architecture
3 platens, 4 head
2 brushes enhance cleaner effective
High WPH
2. Process
满足特殊工艺以及三代半导体需求(WIW&WTW<5%)
干进干出工艺,降低wafer二次沾染
3. Advanced Process Control
I-scan/Laser/Motor torque
应用领域:应用于IC制造、STI,ILD,contactor,metal line、BCD,IGBT,5G芯片制造中的平坦化工艺,满足特殊工艺以及三代半导体需求(碳化硅等)
核心参数:一、Semicore Horizon-T 200CMP
Oxide 运行指标
1. Hardware criteria
WPH:45
MTBF:>200hrs
MTTR:<3.5hrs
2. Process basic criteria
Removal rate NU(5mm EE):<3%(mean)&<5%(max)
Head to Head RR Range:≤200A/min
二、Semicore Horizon-T 200CMP
W 运行指标
1. Hardware criteria
WPH:35
MTBF:>200hrs
MTTR:<3.5hrs
2. Process basic criteria
Removal rate NU(5mm EE):<3%(mean)&<5%(max)
Head to Head RR Range:≤300A/min
三、Semicore Horizon-T 150CMP
Oxide 运行指标
1. Hardware criteria
WPH:45
MTBF:>200hrs
MTTR:<3.5hrs
2. Process basic criteria
Removal rate NU(5mm EE):<8%
Head to Head RR Range:≤200A/min
四、Semicore Horizon-T 150CMP
W 运行指标
1. Hardware criteria
WPH:35
MTBF:>200hrs
MTTR:<3.5hrs
2. Process basic criteria
Removal rate NU(5mm EE):<8%
Head to Head RR Range:≤300A/min
联系人:李岩 联系方式:18515063073